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Power and Compound Fab Capacity Forecast to Reach Over 10 Million Wafers Per Month in 2023 Article By : SEMI

Worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month for the first time in 2023.

Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions wrought by the pandemic, worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month (WPM) for the first time in 2023, growing to 10.24 million WPM (in 200mm equivalents) and climbing to 10.6 million WPM in 2024, according to SEMI’s Power Compound Fab Report to 2024.

China is expected to claim the largest share of installed capacity—33%—by 2023, followed by Japan at 17%, Europe and the Mideast at 16%, and Taiwan at 11%, proportions that are expected to change little as the industry remains on track to add more than 360,000 WPM in 2024.

The SEMI Power Compound Fab Report to 2024 reveals that 63 companies are expected to add more than 2 million WPM (in 200mm equivalents) from 2021 through 2024. Infineon, Hua Hong Semiconductor, STMicroelectronics, and Silan Microelectronics will lead the way, together adding a projected 700,000 WPM.

10/17-19 EAC